The US memory maker Micron is investing $24 billion in a new wafer fabrication plant in Singapore.

The facility will be built out over the next decade and is set to begin producing NAND memory chips in the second half of 2028, across 65,000 square meters of cleanroom space.

🏭 Doubling down on Singapore: About 98% of Micron’s flash memory is already produced there. In parallel, the company is building a $7 billion HBM packaging facility for AI chips, scheduled to come online in 2027.

The Details

Strategic shift: Micron is effectively concentrating its flash production in Singapore, turning the city-state into its core memory hub in Asia.

  • Parallel expansion: Micron is also in talks over a $1.8 billion DRAM fab in Taiwan.

Market reality: Forecasts point to a 55–60% price jump in enterprise SSDs. Micron ranks fourth in flash, with roughly 13% market share.

Supply tightness: Analysts expect persistent memory shortages through end-2027, as Samsung and SK Hynix also accelerate new production lines.

Background

🇸🇬 Singapore as a strategic node: Politically stable, IP-secure, and home to a deeply embedded supply chain for high-yield memory fabs.

The bottleneck is no longer compute, but memory integration. The AI boom is shifting constraints from processors to HBM, NAND, and advanced packaging—precisely where global capacity is scarce.

Enterprise SSDs and HBM are already being pre-booked via long-term contracts. Anyone without secured wafer capacity for 2026–2028 risks being shut out of AI supply chains entirely.

👉 Full story: DealStreetAsia, Nikkei

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